Takaoka Electric Manufacturing Co., Ltd.

JAPANESE
Takaoka Electric Manufacturing Co., Ltd. provides customers with consistent support from product development and manufacturing to marketing and servicing.

Bump inspection systems

Designed for IC package Substrates (in-tray) TVI-5200EX α
Designed for IC package Substrates (in-tray)
TVI-5200EX α
Wafer bump inspection system WVI-6000 α
Wafer bump inspection system
WVI-6000 α

Our bump inspection system pursues high performance, focusing on high-precision technology and inline total inspection which are indispensable for state-of-the-art device implementation.
For 3-dimentional inspections (bump height and bump coplanarity), our unique “non-scanning multi-beam confocal optical sensor“ ensures the highest level of measurement performance, contributing to improvements in quality and reductions in inspection costs for our customers.


ELECTRONICS UNIT

Sales office

TOKYO / NAGOYA

Plant

HAMAMATSU (SHIZUOKA)

CONTACT

Phone : +81.3.5276.0591
Facsimile : +81.3.5276.3181
E-mail : fa_sys@tok.takaoka.co.jp
HAMAMATSU (SHIZUOKA)